Unrivaled Thermal Management
Extreme-Temperature Stability
Superior High-Frequency Performance
Ultra-High Density & Miniaturization
Zero Degradation in Harsh Conditions
High Voltage/Current Reliability
Base Material | Fr4 | Board Thickness | 1.6mm |
Copper Thickness | 10Z | Min. Hole Size | 0.02mm |
Min. Line width | 3mile | Min. Line Spacing | 3mile |
Surface Finishing | HASL/OSP/ENIG | Board size | Optional |
Solder Mask Color | White Black Yellow Green Red | Silkscreen color | Customize |
Material | FR4 /aluminum/ceramic CEM1 | Product name | Shenzhen Multilayers CeramicPCB |
Process | Key Features | Best For | Limitations |
---|---|---|---|
DPC | Laser-drilled 50-μm vias;Cudirect-plated;< 0.15-mm substrates | High-precisionRF/Aerospace | Higher cost; laser-only cutting |
DBC | 150-300-um Cu fused to ceramic; high power handling | EV power controllers,IGBTS | Limited fine-line resolution |
HTCC | 1300°C+ co-firing; tungsten/molybdenum traces | Nuclear/space systems | Ultra-high cost; material shrinkage |
LTCC | 850°C processing; integrated passives | RF filters, LED arrays | Lower thermal conductivity |