Firmware Flashing for PCB Assembly

One-stop SMT assembly

Our factories provide high -quality SMT assembly services for medical, aerospace, national defense industry, automobiles, communications and consumer electronics.

Firmware Flashing

Firmware flashing is the process of transfering the firmware into MCU/Microcontroller/Chip by certain software which issued from MCU manufacturers, such as STmicroelectronics, Atmel, Arduino and Espressif, by dedicated tools like programmer(USB-TTL,etc) or a flash programming fixture for production.

As a One-stop manufacturer, Benlida also provides the service to flash the firmware into the PCBA boards, then go for next step: functional testing.

If you need this service, please consider to provide firmware, operation instruction/guide to us, then we will do before functional testing.

WHY CHOOSE BENLIDA

Quality Assurance

BENLIDA guarantees superior product quality by sourcing high-grade raw materials, adhering to internationally certified quality management systems, and implementing a rigorous six-stage inspection process to proactively prevent defects

Competitive Prices

Maintaining in-house manufacturing facilities grants us direct oversight over both quality standards and production expenditures. Furthermore, our established network of dependable suppliers provides certified materials at competitive pricing.

Fast delivery

We have 8 high-speed SMT mating lines，Daily production capacity exceeds 30 million points.We can quickly complete the customer’s order.

Thoughtful service

24-hour rapid response to provide you with one-on-one nanny consultant pre-sales, sales, after-sales tracking service, for you to answer any difficult questions.

SMT Assembly Process Step

Solder Paste Application

Stencil printing deposits precise amounts of solder paste onto designated PCB contact pads.

Component Placement

Automated pick-and-place machines retrieve surface-mount devices (SMDs) and accurately position them onto the solder paste-coated pads.

Reflow Soldering:

Boards pass through a controlled thermal oven, melting the solder paste to form permanent electrical and mechanical connections.

Automated Optical Inspection (AOI):

Vision systems verify component presence, placement accuracy, polarity, and basic solder joint quality post-reflow.

Through-Hole Component Insertion

Remaining non-SMD parts (connectors, large capacitors) are manually or automatically inserted into plated through-holes.

Wave Soldering (For Mixed Technology):

Boards with through-hole components pass over a molten solder wave, forming connections on the underside.

Conformal Coating (If Required):

Protective chemical layer applied to shield assembled boards from environmental factors (moisture, dust, chemicals).

Secondary Reflow (For Double-Sided Assembly):

Process repeats (steps 1-4) for components on the board's opposite side, using higher-temperature solder or adhesive.

Advanced Inspection & Testing:

X-ray Inspection (AXI): Examines hidden connections (BGAs, QFNs) for voids, bridging, or alignment defects.

In-Circuit Testing (ICT): Electrical verification of component functionality and circuit performance.

Functional Testing (FCT): Validates the fully assembled board against operational specifications.

Cleaning & Final Assembly:

Flux residues removed (if needed); boards undergo final integration (housing, connectors) in a controlled environment.

Rework & Repair:

Dedicated stations (BGA rework, SMT IR) correct identified defects for component replacement or solder joint remediation.

Benlida Circuit