Multi-layer PCB

Multi-layer PCBs: Powering Complex Electronics with Unmatched Density & Reliability

Multi-layer PCBs integrate 4–50+ conductive layers into a single compact substrate, enabling unprecedented circuit complexity while solving signal integrity, thermal, and space constraints in cutting-edge applications. From AI servers to implantable medical devices, these advanced boards deliver 10x the functionality of double-sided designs through precision HDI technology, controlled impedance, and intelligent layer stacking.

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Custom Parameters

Advantages

Precision Engineering

Related Products

Manufacturing Capacity and Specifications

Number of Layers

6-layer

Board Thickness

1.6mm

Base Material

FR-4

Copper Thickness

0.5oz-5oz

Min. Hole Size

0.1mm

Min. Line width

0.075mm

Min. Line Spacing

0.075mm

Surface Finishing

Lead Free HASL/OSP,Etc

Service

One-Stop OEM Service

Other Service

Custom Packaging

Why Engineers Choose Multi-layer PCBs: 7 Game-Changing Advantages

Extreme Circuit Density: 0.1mm Microvias & 3μm Lines: Pack 500+ components/cm²—ideal for smartphone motherboards and IoT sensors. 3D Stacked Routing: Replace 6+ single-layer boards with one 12-layer PCB, slashing size by 60%.
Superior Signal Integrity: ±5% Impedance Control: Dedicated signal/ground layers eliminate crosstalk in 25Gbps SerDes interfaces. EMI Shielding: Buried capacitance layers suppress noise by 25dB for medical imaging/AI accelerators.
Advanced Thermal Management: Embedded Copper Planes: Dissipate 100W+ without heatsinks (thermal conductivity: 401 W/m·K). TG-180 Materials: Withstand 20+ reflow cycles at 260°C for automotive under-hood modules.
Mission-Critical Reliability: 1000+ Thermal Cycles (-55°C to 150°C) without delamination—certified for space (MIL-STD-202). CAF-Resistant Laminates: Prevent electrochemical migration in humid environments (85°C/85% RH).
Optimized Power Delivery: Low-Impedance Planes: <10mΩ power distribution for GPU/CPU clusters. Hybrid Materials: Combine FR-4 with Rogers layers for mixed RF/digital systems.
Cost Efficiency: Reduce Assembly Steps: Consolidate functions into one board, cutting labor by 40%. High-Yield Designs: DFM software minimizes layer count while maximizing performance.
Design Flexibility: Rigid-Flex Integration: Bend zones for wearable health monitors. Blind/Buried Vias: Route complex BGA escapes without adding layers.

Precision Engineering

Parameter	Standard Capability	Advanced Option
Layers	4–16	Up to 50+
Line/Space	75/75μm	30/30μm (HDI)
Via Types	Through-hole	Microvia (50μm)
Material	FR-4 High Tg	Rogers 4003C + FR-4 hybrid
Thermal Conductivity	0.3 W/m·K	2.0 W/m·K (metal-core)
Impedance Tolerance	±10%	±3%

Manufacturing Equipment at BENLIDA

contains the mostadvanced equipment required for the manufacture and assembly of your PCBs. Whether you'relooking for standard quick turn PCBs or boards with the tightest tolerances, made from exoticmetals, there's a reason Sierra Circuits leads the industry in quality and performance.

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