Extreme Circuit Density
Superior Signal Integrity
Advanced Thermal Management
Mission-Critical Reliability
Optimized Power Delivery
Cost Efficiency
Material Science | |
High-Tg Laminates | FR-4 with Tg >170掳C or polyimide for 200掳C+ stability. |
Ceramic Hybrids | AlN/DBC substrates for 300 W/m路K thermal conductivity (e.g., fusion reactor sensors). |
Precision Fabrication | |
Controlled Depth Etching | Achieve steep 3:1 aspect ratios on 0.49 mm ultra-thick copper layers without undercut. |
Multi-Step Lamination | Prevent delamination/blistering during 400掳C+ presses for 20+ layer boards. |
Industry | Critical Use Cases | Performance Impact |
Automotive | EV chargers, 800V BMS, ignition systems | Survives 200掳C engine bays; 50% weight reduction vs. wiring |
Power Electronics | Solar inverters (600V+), grid transformers | 40% lower cooling costs; handles 200A continuous current |
Industrial Automation | Motor drives, robotic controllers | Withstands 100,000+ mechanical flex cycles; IP67 rated |
Aerospace & Defense | Avionics power distribution, radar T/R modules | Radiation-hardened; -55掳C to 200掳C operation |
High-Power LEDs | Stadium lighting, automotive headlamps | Eliminates heatsinks; sustains 120掳C junction temps |