Superior Thermal Management
Unmatched Optical Efficiency
High-Power Density & Miniaturization
Harsh-Environment Resilience
Smart Hybrid Integration
Eco-Efficiency & Cost Savings
Process | Key Features | Best For | Limitations |
---|---|---|---|
DPC | Laser-drilled 50-μm vias;Cudirect-plated;< 0.15-mm substrates | High-precisionRF/Aerospace | Higher cost; laser-only cutting |
DBC | 150-300-um Cu fused to ceramic; high power handling | EV power controllers,IGBTS | Limited fine-line resolution |
HTCC | 1300°C+ co-firing; tungsten/molybdenum traces | Nuclear/space systems | Ultra-high cost; material shrinkage |
LTCC | 850°C processing; integrated passives | RF filters, LED arrays | Lower thermal conductivity |