High Frequency PCB

Power the Signal Revolution: High-Frequency PCBs Engineered for Uncompromising Performance

High-Frequency PCBs are specialized circuit boards designed for electromagnetic frequencies ≥1 GHz, enabling ultra-low-loss signal transmission in 5G, radar, satellite systems, and mission-critical RF applications. Unlike standard FR-4 boards, they leverage advanced materials like PTFE (Teflon®), ceramic-filled polymers, or Rogers laminates to achieve dielectric constants (Dk < 3.0) and loss tangents (Df < 0.004)—critical for millimeter-wave integrity and high-speed data transfer up to 40 GHz .

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Custom Parameters

Advantages

Precision Engineering

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Manufacturing Capacity and Specifications

Material

PTFE,Rogers, Panasonic

Board Thickness

0.2mm-3.2mm

Layers

1-12 Layers

Copper Thickness

0.5OZ-1OZ

Surface Finish

ENEPIG, Immersion Ag, OSP

Min. Trace/Space

0.10mm / 0.10mm(depends on design)

Min. Hole Size

0.15mm - 0.20mm

Solder Mask

Optional

Silkscreen

Optional

Why High-Frequency PCBs Dominate Advanced Electronics: 5 Core Advantages

Lightning-Fast Signal Transmission: 3–5× Higher Speeds: Signal propagation inversely relates to the square root of Dk. With Dk as low as 2.2 (vs. FR-4’s 4.5), high-frequency PCBs reduce latency by 50%, enabling 10+ Gbps data rates for 5G base stations and satellite links 136. Near-Zero Distortion: Stable Dk/Df across temperature/humidity swings ensures consistent impedance, eliminating signal reflection in automotive radar (77 GHz) and aerospace systems 410.
Ultra-Low Loss & Superior Signal Integrity: 70% Lower Attenuation: Materials like Rogers RO4350B (Df=0.0037) cut signal loss by 35% at 10 GHz vs. standard laminates, critical for long-range RF identification (RFID) and E-band microwave links 49. Precision Impedance Control: TDR-monitored dynamic compensation maintains ±5% impedance tolerance, boosting radar detection accuracy to ±0.1° 4.
Extreme Environmental Resilience: 0.02% Water Absorption: PTFE-based boards resist humidity-induced Dk drift, outperforming FR-4 in tropical climates 16. -55°C to 150°C Operational Range: Withstand thermal cycling in EV engine bays or satellite avionics, backed by 1.8 N/mm² copper adhesion and 3 kV/mm layer insulation 47.
Power-Efficient Thermal Management: 401 W/m·K Thermal Conductivity: Ceramic-filled substrates (e.g., AlN hybrids) dissipate heat 150× faster than FR-4, slashing cooling needs in 100W+ power amplifiers 410. CTE Matching: Expansion coefficients aligned with copper foil (2.6–3.5 ppm/°C) prevent solder cracks during reflow (300°C+) 29.
EMI Immunity & Noise Suppression: Shielded Ground Layers + 45° Trace Routing: Reduce crosstalk by 40% and radiated emissions by 25 dB, ensuring clean signal output in dense medical imaging or military comms gear

Precision Engineering: Materials & Manufacturing Innovations

Parameter	High-Frequency PCB	Standard FR-4 PCB
Dielectric Constant (Dk)	2.2–3.5 (PTFE/Rogers)	4.3–4.8
Loss Tangent (Df)	0.0009–0.004	0.015–0.025
Thermal Conductivity	0.5–220 W/m·K	0.25 W/m·K
Water Absorption	<0.02%	>0.1%
Impedance Control	±5% tolerance	±10–15% tolerance

Manufacturing Equipment at BENLIDA

contains the mostadvanced equipment required for the manufacture and assembly of your PCBs. Whether you'relooking for standard quick turn PCBs or boards with the tightest tolerances, made from exoticmetals, there's a reason Sierra Circuits leads the industry in quality and performance.

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