Rogers PCB

In the PCB industry, Rogers' materials offer significant advantages over traditional FR-4 materials, primarily for high-frequency, high-speed, and high-reliability applications.

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Product Overview

Advantages

Typical Applications

Common Rogers Material Options

We can manufacture Rogers PCBs using commonly selected Rogers material families such as:

RO4000 Series: Glass-fiber reinforced, strong cost-performance for commercial high-frequency PCBs
RO3000 Series: Ceramic-filled, very low loss for millimeter-wave applications
RT/duroid Series: PTFE-based ultra-low loss substrates for advanced RF designs
TMM Series: High thermal conductivity + low loss + high thermal stability, built for high-performance needs

(Final selection depends on frequency band, loss target, stackup, and fabrication constraints.

Key Advantages

1) Excellent Electrical Performance

Stable Dielectric Constant (Dk): Minimal Dk variation across frequency and temperature helps maintain impedance and phase stability, especially in RF and high-frequency circuits.
Extremely Low Dielectric Loss (Df): Lower loss than FR-4 reduces signal attenuation and improves high-frequency signal integrity, particularly in higher GHz ranges.
Low Surface Roughness Options: Smoother copper foil surfaces help reduce conductor loss caused by skin effect, which becomes more important at millimeter-wave frequencies.

2) Thermal Stability & Reliability

Low CTE (Coefficient of Thermal Expansion): Better CTE matching (especially with copper) reduces risk of via / hole wall stress during temperature cycling—important for multilayer reliability.
High Tg Options: Some Rogers materials support high-temperature processing (including lead-free assembly conditions).
High Temperature & Chemical Resistance: Suitable for demanding environments such as automotive electronics and aerospace-related designs.

3) Mechanical Properties & Process Adaptability

High Dimensional Stability: Low moisture absorption improves stability under humidity and helps reduce deformation during processing and soldering.
Process Compatibility: Rogers materials can be used in hybrid stackups with FR-4 to balance performance and cost (common for RF + control mixed designs).

Why Ceramic Dominates Extreme Environments: 3 Core Advantages

Excellent Electrical Performance: Stable Dielectric Constant (Dk): Minimal Dk variation across frequency and temperature helps maintain impedance and phase stability, especially in RF and high-frequency circuits. Extremely Low Dielectric Loss (Df): Lower loss than FR-4 reduces signal attenuation and improves high-frequency signal integrity, particularly in higher GHz ranges. Low Surface Roughness Options: Smoother copper foil surfaces help reduce conductor loss caused by skin effect, which becomes more important at millimeter-wave frequencies.
Thermal Stability & Reliability: Low CTE (Coefficient of Thermal Expansion): Better CTE matching (especially with copper) reduces risk of via / hole wall stress during temperature cycling—important for multilayer reliability High Tg Options: Some Rogers materials support high-temperature processing (including lead-free assembly conditions). High Temperature & Chemical Resistance: Suitable for demanding environments such as automotive electronics and aerospace-related designs.
Mechanical Properties & Process Adaptability: High Dimensional Stability: Low moisture absorption improves stability under humidity and helps reduce deformation during processing and soldering. Process Compatibility: Rogers materials can be used in hybrid stackups with FR-4 to balance performance and cost (common for RF + control mixed designs).

High-Frequency Communication: 5G base stations/antennas, satellite communication, RF modules
Automotive Radar: 77GHz millimeter-wave radar
Aerospace / Defense: Phased array radar, electronic warfare systems
High-Speed Digital: Optical modules (100G and above), server/networking boards

Considerations

Higher material cost than FR-4: Rogers laminates are typically significantly more expensive than standard FR-4.
More demanding fabrication control: Processing can require tighter control for drilling, etching, and lamination.
Hybrid stackup needs planning: If mixing Rogers + FR-4, CTE matching and stack design must be handled carefully to protect reliability.

Benlida Manufacturing Support (What You Get)

DFM / Engineering review before production to reduce risk in RF impedance, layer build-up, and hybrid lamination designs
Stable material supply chain with Rogers laminate procurement support
Rogers-only or Rogers + FR-4 hybrid builds to balance performance and total cost
Quality-focused production for high-frequency and high-reliability boards

Request a Quote

If you’re designing RF or high-speed boards and need Rogers materials, send us:

Target frequency range (or application type)
Layer count & board thickness requirement
Stackup (if available) or impedance targets
Copper weight / surface roughness preference (if defined)
Gerbers + impedance notes (recommended)

Benlida is a professional PCB manufacturer with over 14 years of experience and a reliable material supply chain. If you need Rogers PCB for your project, contact us anytime.

Manufacturing Equipment at BENLIDA

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