Unrivaled Thermal Management
Extreme-Temperature Stability
Superior High-Frequency Performance
Ultra-High Density & Miniaturization
Zero Degradation in Harsh Conditions
High Voltage/Current Reliability
In the PCB industry, Rogers' materials offer significant advantages over traditional FR-4 materials, primarily for high-frequency, high-speed, and high-reliability applications.
Rogers PCB refers to printed circuit boards built with Rogers high-performance laminates (instead of conventional FR-4), designed for:
High-frequency / microwave circuits
High-speed and low-jitter digital transmission
High-reliability electronics that face thermal cycling, humidity, or harsh environments
Stable Dielectric Constant (Dk): Minimal Dk variation across frequency and temperature helps maintain impedance and phase stability, especially in RF and high-frequency circuits.
Extremely Low Dielectric Loss (Df): Lower loss than FR-4 reduces signal attenuation and improves high-frequency signal integrity, particularly in higher GHz ranges.
Low Surface Roughness Options: Smoother copper foil surfaces help reduce conductor loss caused by skin effect, which becomes more important at millimeter-wave frequencies.
Low CTE (Coefficient of Thermal Expansion): Better CTE matching (especially with copper) reduces risk of via / hole wall stress during temperature cycling鈥攊mportant for multilayer reliability.
High Tg Options: Some Rogers materials support high-temperature processing (including lead-free assembly conditions).
High Temperature & Chemical Resistance: Suitable for demanding environments such as automotive electronics and aerospace-related designs.
High Dimensional Stability: Low moisture absorption improves stability under humidity and helps reduce deformation during processing and soldering.
Process Compatibility: Rogers materials can be used in hybrid stackups with FR-4 to balance performance and cost (common for RF + control mixed designs).
High-Frequency Communication: 5G base stations/antennas, satellite communication, RF modules
Automotive Radar: 77GHz millimeter-wave radar
Aerospace / Defense: Phased array radar, electronic warfare systems
High-Speed Digital: Optical modules (100G and above), server/networking boards
We can manufacture Rogers PCBs using commonly selected Rogers material families such as:
RO4000 Series: Glass-fiber reinforced, strong cost-performance for commercial high-frequency PCBs
RO3000 Series: Ceramic-filled, very low loss for millimeter-wave applications
RT/duroid Series: PTFE-based ultra-low loss substrates for advanced RF designs
TMM Series: High thermal conductivity + low loss + high thermal stability, built for high-performance needs
(Final selection depends on frequency band, loss target, stackup, and fabrication constraints.)
Higher material cost than FR-4: Rogers laminates are typically significantly more expensive than standard FR-4.
More demanding fabrication control: Processing can require tighter control for drilling, etching, and lamination.
Hybrid stackup needs planning: If mixing Rogers + FR-4, CTE matching and stack design must be handled carefully to protect reliability.
DFM / Engineering review before production to reduce risk in RF impedance, layer build-up, and hybrid lamination designs
Stable material supply chain with Rogers laminate procurement support
Rogers-only or Rogers + FR-4 hybrid builds to balance performance and total cost
Quality-focused production for high-frequency and high-reliability boards
If you鈥檙e designing RF or high-speed boards and need Rogers materials, send us:
Target frequency range (or application type)
Layer count & board thickness requirement
Stackup (if available) or impedance targets
Copper weight / surface roughness preference (if defined)
Gerbers + impedance notes (recommended)
Benlida is a professional PCB manufacturer with over 14 years of experience and a reliable material supply chain. If you need Rogers PCB for your project, contact us anytime.
| Process | Key Features | Best For | Limitations |
|---|---|---|---|
| DPC | Laser-drilled 50-渭m vias;Cudirect-plated;< 0.15-mm substrates | High-precisionRF/Aerospace | Higher cost; laser-only cutting |
| DBC | 150-300-um Cu fused to ceramic; high power handling | EV power controllers,IGBTS | Limited fine-line resolution |
| HTCC | 1300掳C+ co-firing; tungsten/molybdenum traces | Nuclear/space systems | Ultra-high cost; material shrinkage |
| LTCC | 850掳C processing; integrated passives | RF filters, LED arrays | Lower thermal conductivity |