Rigid Flex PCB

Rigid-Flex PCBs: Where Robust Meets Resilient — Revolutionizing Dense & Dynamic Electronics

Rigid-Flex PCBs seamlessly integrate rigid sections (for component stability) with flexible circuits (for 3D motion) in a single unified design. This hybrid technology eliminates connectors and wiring harnesses, slashing failure points by 70% while enabling unprecedented packaging freedom in aerospace, medical implants, and foldable devices. Withstand 200,000+ bend cycles and extreme environments from -200°C to 150°C.

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Custom Parameters

Advantages

Precision Engineering

Related Products

Manufacturing Capacity and Specifications

Material

Rigid: FR-4
Flexible: PI/PET

Board Thickness

Rigid: 0.8mm-3.0mm
Flexible: 0.10mm-0.30mm

Layers

4-16 Layers

Copper Thickness

0.5OZ-3OZ

Surface Finish

LF-HASL, ENIG, ENEPIG, OSP, etc

Min. Trace/Space

0.1mm/0.1mm

Min. Hole Size

0.15mm

Solder Mask

Optional, normally Green, Blue, Red, Black, etc

Silkscreen

Optional, normally White or Black

Five Unbeatable Advantages of Rigid-Flex PCBs

Unbreakable Reliability: Zero Connectors: Eliminate 90% of solder joints—critical for satellite avionics (MIL-STD-202G) and pacemakers. 20× Shock/Vibration Resistance vs. rigid boards (tested to 100G acceleration).
Radical Space & Weight Savings: 60% Thinner Assemblies: Fold circuits into watch-sized medical monitors or drone gimbals. 3D Topology Optimization: Fit curved surfaces like endoscope shafts or EV battery trays.
Extreme Environment Survival: Hermetic Polyimide Flex Layers: 0% moisture absorption (IP68-rated). Aerospace-Grade Resilience: Operate in radiation zones (100 krad) and vacuum.
Hermetic Polyimide Flex Layers: 0% moisture absorption (IP68-rated). Aerospace-Grade Resilience: Operate in radiation zones (100 krad) and vacuum.: Single Integrated Assembly: Cut production steps by 50% vs. multi-board systems. Automated Flex Bonding: Achieve 99.98% yield with laser-aligned lamination.
Signal Integrity Mastery: Controlled Impedance Across Bends: ±7% tolerance at 25 GHz via folded differential pairs. EMI Shielding: Copper-inlaid flex layers block noise in MRI machines.

Materials & Stackup Innovations

Layer Type	Materials	Key Properties
Rigid Sections	FR-4, Rogers 4350B, High-Tg	Component mounting; 20+ layers
Flex Zones	Polyimide (Upilex®), LCP	25μm thin; 500K+ bend cycles
Adhesives	Acrylic, Epoxy	300% elongation for dynamic flexing
Shielding	Copper-filled microvias	40dB EMI reduction

Industry-Defining Applications

Sector	Breakthrough Use	Performance Leap
Medical	Implantable neurostimulators	0.4mm thickness; survives body fluids
Aerospace	Satellite solar array controllers	-200°C to 120°C in vacuum; 50% lighter
Consumer	Rollable displays, AR glasses	500K folds without trace damage
Automotive	Steering wheel sensor arrays	Vibration-proof in -40°C to 150°C
Defense	Wearable battlefield comms	EMP-hardened; mud/water resistant

Manufacturing Equipment at BENLIDA

contains the mostadvanced equipment required for the manufacture and assembly of your PCBs. Whether you'relooking for standard quick turn PCBs or boards with the tightest tolerances, made from exoticmetals, there's a reason Sierra Circuits leads the industry in quality and performance.

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