X-ray

X-ray

For PCBA (Printed Circuit Board Assembly) quality management, X-ray inspection is a key non-destructive inspection technology, primarily to inspect defects which hidden or covered by packages, such as solder balls of BGA, that cannot be checked by visual inspection(bare-eye) and electrical testing.

此处在右侧放置视频，方便读者点击观看

I. Principles of X-ray Inspection

Different materials have different absorption rates of X-rays (e.g., metals have high absorption rates, plastics/silicon have low absorption rates), thus X-ray could penerate the subjects and forming high-contrast, two-dimensional or three-dimensional images on the dispaly such as computor screen, thus revealing the internal structure.

II. Main Inspection Items

1. Soldering Quality Analysis

- Hidden solder joints such as BGA/CSP/QFN: Detecting solder ball voids, bridging/short, cold solder joints, misalignment, etc.

- Through-hole soldering: Checking for insufficient solder filler, porosity, and insertion deviation.

- Solder paste printing quality: Assessing the amount and uniformity of solder paste distribution (must be checked before reflow soldering).

2. Internal Structural Defects

- Interlayer Alignment: Misalignment of inner layers in multilayer PCBs.

- Wire/via integrity: Inspect for cracks, breaks, and uneven copper plating on via walls.

- Internal component defects: Such as chip package cracks, poor wire bonding, and voids.

3. Alien Objects and contamination

- Residual metal debris, fibers, and other conductive foreign objects.

4. Assembly verification

- Component misassembly, omissions, and reverse polarity (identified by shape and internal structure).

- Potential short circuit risk due to insufficient pin spacing.

III. Technical advantages

- Non-destructive imaging: Does not damage the PCBA, suitable for full inspection or sampling.

- High resolution: Micrometer-level identification (e.g., cracks <1μm).

- Automated analysis: With AI algorithms, automatically marks and classifies defects (e.g., void rate calculation).

- 3D CT scanning: Provides tomographic imaging, accurately locating three-dimensional defects.

此处插入图1

IV. Typical workflow

1. PCBA positioning: Place the PCBA on the stage or fixture and set the inspection area&angle.

2. Parameter Settings: Adjust X-ray voltage, current, and focal length according to board thickness and component density of PCBA.

3. Image Acquisition: Obtain 2D projection or 3D scan data.

4. Image Analysis:

- Visual Interpretation: Experienced personnel compare with standard images.

- Automated Software Analysis: Such as measuring solder ball void ratio (IPC standards typically require ≤25%), detecting bridging, etc.

5. Result Output: Generate an inspection report, indicating the location and type of defects.

V. Industry Standards and Specifications

- IPC Standards: Such as IPC-A-610 (Electronic Assembly Acceptability), IPC-7095 (BGA Design and Assembly Process Guidelines).

- Void Ratio Assessment: Typically follows customer specifications or industry practices (e.g., automotive electronics have stricter requirements).

- J-STD-001: Requirements for Soldering Electrical and Electronic Components.

VI. Application Scenarios

- High Reliability Fields: Automotive electronics, aerospace, medical devices.

- High-Density Packaging: Smartphones, wearable devices, microprocessor modules.

- Fault Analysis: Root cause analysis of returned parts.

VII. Limitations

- High Cost: High investment and maintenance costs.

- Inspection Speed: 3D scanning is time-consuming, potentially affecting production cycle time.

- Material Limitations: High-density metal shielding layers (such as thick copper foil) may affect image quality.

- Radiation Safety: Strict management of operator protection and equipment shielding is required.

VIII. Technological Development Trends

- AI and Machine Learning: Automatic Defect Identification (ADI) systems reduce human error.

- Online Integration: Linked with SMT production lines to achieve real-time process feedback.

- High Resolution and High-Speed Scanning: Micro-focus X-ray and rapid CT improve inspection efficiency.

- Multimodal Data Fusion: Combining infrared thermal imaging, ultrasonic data, and other data for comprehensive judgment.

IX. Implementation Recommendations

1. Define Inspection Objects: Define inspection standards based on key product characteristics (e.g., BGA solder joints, automotive ECU modules).

2. Process Integration: X-ray data is fed back to the SMT process to optimize solder paste printing and reflow molding profiles.

3. Personnel Training: Operators must master basic image interpretation and equipment maintenance knowledge.

4. Data Management: A defect database is established for Statistical Process Control (SPC) and quality traceability.

X-ray inspection has become an important process of modern PCBA quality control, especially with the miniaturization and development of  high-density electronic components, it's value is prominent. The proper application of this technology can improve product reliability and reduce after-sales risks significantly. Customers and manufacturers need to combine their own product characteristics and quality requirements, balance inspection costs and benefits, and formulate scientific inspection plans.

Benlida is a professional PCB and PCBA manufacturer, continuously invest in advanced equipment and had invested X-ray inspection equipment, provide customers with high-quality PCBs & PCBAs and excellent services continuously that keep up with the latest trends! If your PCBA requires X-ray inspection services, please contact Benlida!