Material: FR-4 TG150
Board Thickness: 1.6mm
Layers: 2
Copper Thickness: 1OZ
Surface Treatment: Lead Free-HASL
Solder Mask: Green
Silkscreen: White
| Process | Key Features | Best For | Limitations |
|---|---|---|---|
| DPC | Laser-drilled 50-渭m vias;Cudirect-plated;< 0.15-mm substrates | High-precisionRF/Aerospace | Higher cost; laser-only cutting |
| DBC | 150-300-um Cu fused to ceramic; high power handling | EV power controllers,IGBTS | Limited fine-line resolution |
| HTCC | 1300掳C+ co-firing; tungsten/molybdenum traces | Nuclear/space systems | Ultra-high cost; material shrinkage |
| LTCC | 850掳C processing; integrated passives | RF filters, LED arrays | Lower thermal conductivity |