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HDI PCB (High-Density Interconnect Printed Circuit Board) is advanced circuit boards with much higher wiring density, smaller features (traces, vias, pads), and often more layers than traditional PCBs, achieved using technologies like microvias, blind/buried vias, and via-in-pad, leading to smaller, lighter, faster, and higher-performing electronics in demanding applications like smartphones, medical devices, and automotive systems.
- Higher Density: More connections in the same area due to finer lines and spaces, allowing for more components and complex routing.
- Microvias: Very small holes (often laser-drilled) connecting layers, replacing larger, traditional drilled holes.
- Blind & Buried Vias: Vias that connect outer layers to inner layers (blind) or inner layers to other inner layers (buried), saving space.
- Via-in-Pad: Placing vias directly within component pads for direct connections, maximizing space.
- Improved Performance: Shorter signal paths, reduced reflections, better signal integrity, and faster speeds.
- Mobile Devices: Smartphones, tablets.
- Automotive: Advanced driver-assistance systems (ADAS), infotainment.
- Medical: Imaging, monitoring, surgical equipment.
- Industrial: Automation, IoT devices, smart sensors.
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