HDI PCB

The Ultimate High-Density Interconnect Solution for Next-Gen Miniaturization

High-Density Interconnect (HDI) PCBs leverage microvias, ultra-fine traces, and advanced stacking to deliver 10× the component density of traditional boards—enabling revolutionary designs in smartphones, wearables, and AI hardware. With ≤40μm lines/spaces, laser-drilled microvias down to 50μm, and any-layer interconnects, HDI technology slashes package size while boosting signal speed and reliability.

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Custom Parameters

Advantages

HDI Technology Breakdown

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Manufacturing Capacity and Specifications

Material

FR-4,Panasonic Megtron Series,
Rogers RO4000 Series/RO3000 Series

Board Thickness

0.8mm-3.0mm

Layers

6-20 Layers

Copper Thickness

1/3OZ, 1/2OZ,1OZ, 2OZ

Surface Finish

ENIG,ENEPIG, Immersion Silver, Immersion Tin

Min. Trace/Space

≥ 0.10mm / 0.10mm

Min. Hole Size

0.15mm-0.20mm

5 Game-Changing Advantages of HDI PCBs

Extreme Miniaturization: 0.3mm BGAs & 20μm Traces: Fit 5,000+ components in smartwatch-sized spaces (e.g., 12-layer boards at 0.8mm thickness). 60% Size Reduction vs. standard PCBs—critical for AR glasses and implantable medical sensors.
Lightning-Fast Signal Integrity: <0.2dB Loss at 40GHz: Low-Dk materials (Rogers 4003C, Megtron 7) enable 112G PAM-4 SerDein AI accelerators. ±3% Impedance Control: Buried capacitance layers suppress EMI by 25dB.
Enhanced Reliability: Microvia-in-Pad Technology: Eliminate solder cracks with 100% via fill (IPC-6012 Class 3). CAF-Resistant Laminates: Survive 1,000+ thermal cycles (-55°C to 260°C).
Power Efficiency: Shorter Signal Paths: Cut power consumption 30% in 5G mmWave modules. Embedded Passives: Replace 40% of discrete components for cleaner power delivery.
Cost Optimization: Fewer Layers, Higher Function: 8 HDI layers outperform 16 standard layers—saving 25% on material costs. High-Yield Manufacturing: Laser direct imaging (LDI) achieves 99.95% defect-free microvias.

HDI Technology Breakdown

Parameter	Standard HDI	Advanced HDI
Line/Space	50/50μm	30/30μm
Microvia Diameter	75μm	50μm (stacked)
Layer Count	4–12	Up to 20+
Materials	FR-4 Tg170	Megtron 7/Rogers hybrid
Via Types	Blind/Buried	Any-Layer VIPPO
Surface Finish	ENIG	ENEPIG/OSP

Precision Engineering: Industry-Leading Applications

Industry	Breakthrough Use Case	Performance Gains
Consumer Tech	Foldable smartphones	0.4mm board thickness; 100,000+ flex cycles
Medical	Neural implant controllers	0.2mm microvias; biocompatible coatings
5G/AI	mmWave phased-array antennas	64 elements in 10×10mm; 28GHz operation
Automotive	LiDAR perception modules	-40°C–150°C operation; ASIL-D compliance
Aerospace	Satellite communication systems	Radiation-hardened; 40GHz signal integrity

Manufacturing Equipment at BENLIDA

contains the mostadvanced equipment required for the manufacture and assembly of your PCBs. Whether you'relooking for standard quick turn PCBs or boards with the tightest tolerances, made from exoticmetals, there's a reason Sierra Circuits leads the industry in quality and performance.

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