Industry News

​In the world of high-performance hardware, the silicon die often gets all the glory. However, as we push toward the limits of Moore’s Law, the real innovation is happening in the "package"—specifically within the IC substrate assembly process. These ultra-high-density interconnect (HDI) boards are the unsung heroes that allow a sub-nanometer chip to communicate with a millimeter-scale PCB without losing signal integrity or overheating.