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Material properties set the limits for thermal management in led pcb design. FR-4, a common pcb substrate, has low thermal conductivity (0.3–0.4 W/mK). This leads to poor heat transfer and heat accumulation near led junctions. Aluminum pcbs offer much higher conductivity (200–235 W/mK), which enables rapid heat transfer and reduces junction temperature. Copper provides even better heat dissipation (380–400 W/mK), making it ideal for high-power applications.